Author name: Holger Höhn

Process Fellows workshop “Opportunity or Burden – Guideline for Implementation of Mechanical SPICE” on the occasion of the VDA Automotive SYS Conference 2019 in Potsdam, Germany

Who doesn’t remember the introduction of Automotive SPICE® in the company when experts were confronted with the “How?” and “Why?” of the new standard. The introduction of the new standard “SPICE for Mechanical Engineering”, which has been introduced as part of the Automotive SPICE® plugin concept a few months ago, is another example of this. Consultants and experts are repeatedly confronted with the hurdles, but also with the opportunities, of the introduction.

Process Fellows workshop “Opportunity or Burden – Guideline for Implementation of Mechanical SPICE” on the occasion of the VDA Automotive SYS Conference 2019 in Potsdam, Germany Read Post »

SAFe plus Automotive SPICE® – Is this still agile?

This issue will be discussed on the occasion of the evening event on June 5, 2019 in Wiesbaden, Germany, starting at 6:00pm, which the Process Fellows and Kegon AG will be organizing as part of an ASQF® SIG (special interest group) meeting, a meeting that takes place regularly on different topics. The ASQF® is a competence network for software quality in the German-speaking area.

SAFe plus Automotive SPICE® – Is this still agile? Read Post »

Case Study: Process Improvement at NIDEC GPM GmbH

“Thanks to the open, well-founded and structured cooperation with Process Fellows, we were able to very quickly achieve initial successes in the project that were directly visible both in the organization and at the customer. Due to the positive results, NIDEC GPM GmbH moved into the role of pilot for the entire European organization of NIDEC Automotive. Here, too, Process Fellows provided support through suggestions for the best possible project setup. Through the direct participation in the project, the processes and improvements are developed together with the employees, which leads to a very high acceptance of the results in the organization. Agile methods are very popular in the development teams due to the coaching of process fellows, here we are currently preparing a further cooperation beyond the topic ASPICE® and electronics development”.

Jens Hoffmann, Director Systems Engineering, Electronics and Software Development
NIDEC GPM GmbH

Case Study: Process Improvement at NIDEC GPM GmbH Read Post »

Process Fellow goes JAPAN – “Alternation of Generations – How Our Way of Development Will Change With SPICE”​

PROCESS FELLOWS consultant Timo Karasch went to Japan last month to hold a keynote at the NSPICE Conference in Nagoya.
In his keynote Timo Karasch mentioned that intacs™ is working on new variants of SPICE, like Mechanical or Hardware SPICE in its working groups.

Process Fellow goes JAPAN – “Alternation of Generations – How Our Way of Development Will Change With SPICE”​ Read Post »

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